Maikolofoni ya Tebulo la Misonkhano Dante Networked Conference Unit HY-D630D

Tengani ukadaulo wa msonkhano wa digito wa DSP audio processing chip, kuzindikira kufalitsa ndi kukonza chizindikiro cha digito;

Kugwiritsa ntchito ndodo ya maikolofoni ya gooseneck, mutu wonyamula wa condenser wa 9.7 mm wokhala ndi golide wokhazikika mkati mwake;

Kapangidwe kapadera ka m'mimba, kamatha kuwongolera molondola ngodya ya pickup, kupewa kuyimba mluzu ndi kuyimba mluzu;

Aloyi ya zinc-aluminium yokhala ndi galasi lolimba la Mohs 6 touch hardness kapena touch acrylic panel, gululi limapangidwa ndi CNC machining;

Gwiritsani ntchito FTC334C ukadaulo wokonza makiyi okhudzidwa ndi kukhudza, moyo wautali wautumiki, palibe phokoso la makiyi amakina mukasintha;

Ukadaulo wotumizira mawu mosataya mtengo, ma frequency a 48KHz audio sampling, pickup yovuta, mawu omveka bwino, mayankho a pafupipafupi mpaka 30Hz-20KHz;

Kapangidwe kake kokhala ndi mphamvu zambiri, kokhala ndi ntchito yodzipangira yokha ya AGC, kuti zitsimikizire mtunda wa pickup ndi mtundu wa mawu;

Kugwiritsa ntchito ukadaulo wamphamvu wa digito woletsa kusokoneza zinthu kuti zitsimikizire kuti zida zomwe zili pamalopo sizikusokonezedwa ndi mafoni am'manja, Bluetooth, wailesi, WiFi ndi zizindikiro zina;

2022 HUAIN idapatsidwa ulemu ndi dzina la "Makampani Ang'onoang'ono ndi Apakatikati Ochokera ku Sayansi ndi Ukadaulo ku Guangdong", komanso idapatsidwa ulemu ndi dzina la "National High-tech Enterprise". M'chaka chomwecho, tidapanga maikolofoni yoyamba padziko lonse lapansi yokhala ndi "kuchaja opanda zingwe", yomwe idathetsa mavuto ambiri a dongosolo la misonkhano yopanda zingwe. 2023 HUAIN idawonjezera ma patent angapo ndipo idapatsidwa dzina la "Makampani Apadera, Apadera ndi Atsopano a Chigawo cha Guangdong" m'chaka chomwecho. Malo ogulitsa ndi mautumiki apadziko lonse adafalikira mdziko lonselo, ndikukhazikitsa ofesi yoyamba yakunja. Idayambitsa dongosolo loyamba padziko lonse la "msonkhano wotsutsana ndi kuba" ndi dongosolo loyamba la misonkhano la "nano-fingerprint-proof" la makampani, lomwe lidathetsa mavuto amakampani ndikukopa chidwi cha makampani. 2024 Dadi Insurance, BOE ndi makampani ena otchuka. Idayambitsa dongosolo latsopano la misonkhano ya digito lozikidwa pa kapangidwe ka FPGA. Idayambitsa "Star Series" yatsopano ndikufunsira Mphotho ya Red Dot ndi Mphotho ya IF. Inayambitsa dongosolo loyamba la misonkhano padziko lonse lapansi la "opanda mapepala", lomwe linalandiridwa bwino ndi makasitomala akumaloko ndi akunja. Kumalizidwa kwa nyumba yaikulu padziko lonse ya Huain kukuyimira kulowa kwa Hwayin mu nthawi yatsopano ya chitukuko, ndipo ipitiliza kulimbikitsa zatsopano ndikutsegula tsogolo labwino kwambiri.